| Property | Value |
| Chemical Basis | Modified oxime silicone |
| State | Thixotropic paste |
| Skin Forming Time (ASTM D-4678) | 7 minutes |
| Dry Surface (ASTM D-4678) | Approx. 10 minutes |
| Curing Speed | Approx. 2 mm / 24 hrs (73.4°F / 50% RH) |
| Hardness Shore A (ASTM D-676) | 40 |
| Tensile Strength (ASTM D-412) | Approx. 2.2 N/mm² |
| Elongation at Rupture (ASTM D-412) | 270 - 300% |
| Thermal Conductivity (ASTM D-2214/70) | 0.002 J·cm?¹·s?¹·K?¹ |
| Coefficient of Thermal Expansion (ASTM EB-31) | 20 × 10?5 K?¹ |
| Dielectric Strength (ASTM D-149) | 15 kV/mm |
| Dielectric Constant @ 1 MHz (ASTM D-150) | 2.8 |
| Loss Factor @ 1 MHz (ASTM D-150) | 0.002 |
| Volume Resistance (ASTM D-257) | 1 × 1015 V/cm |
